Samsung Electronics started shipping samples of its next-generation 12-layer HBM4E chips.
The move positions Samsung ahead of rival SK hynix in the high-performance AI memory market.
SK hynix currently leads the HBM sector and serves as a primary supplier to Nvidia.
Samsung’s early delivery precedes the SK hynix HBM4E sample timeline of late 2026.
SK hynix plans to begin mass production of its HBM4E chips in 2027.
Samsung aims to secure early design wins and volume orders from major AI chip designers.