Xiaomi unveiled the Xring O3, an in-house smartphone processor manufactured using TSMC’s 3-nanometer process. This move aims to increase supply chain control and reduce reliance on external suppliers like Qualcomm and MediaTek. The chip will debut in Xiaomi’s upcoming flagship foldable smartphone.
The company also announced the Xring O100, a custom AI accelerator for on-device large language models. Additionally, Xiaomi introduced the Xring D100 chip designed for autonomous driving.
These developments support Xiaomi’s strategy to build a self-reliant ecosystem across smartphones, AI, and electric vehicles. The company has invested over $3 billion in its chip development program.