Aeluma, Inc. signed a non-binding letter of intent for up to $30 million in proposed funding from the U.S. Department of Commerce. This award originates from the CHIPS and Science Act. The investment supports research and development for the company’s non-Indium Phosphide semiconductor manufacturing platform.
The project aims to scale production of photonic components like high-speed photodetectors and lasers. Aeluma will utilize 300mm substrates to reduce costs and address supply chain constraints. This technology serves as a critical component for next-generation AI interconnects and advanced computing.
The final award remains contingent on the completion of due diligence. Both parties must also execute definitive agreements before the funding is finalized.