Broadcom joined Applied Materials’ Equipment and Process Innovation and Commercialization (EPIC) platform as an innovation partner. The collaboration focuses on developing advanced chip packaging for next-generation AI systems at the EPIC Center in Silicon Valley.
The partnership marks an industry shift toward co-development between equipment makers and chip designers. This approach manages the complexity of heterogeneous integration required for AI.
Joint R&D will target AI compute scaling bottlenecks, specifically interconnect density and thermal management. These technical areas are central to Broadcom’s 3D stacking roadmap.