Applied Materials formed a strategic partnership with Broadcom to develop advanced packaging for next-generation AI chips. Broadcom joins the Equipment and Process Innovation Center (EPIC) platform as an innovation partner.
The collaboration utilizes Applied’s global R&D network and its new EPIC Center in Silicon Valley. This partnership addresses rising demand for high-performance, energy-efficient computing infrastructure.
Broadcom receives early access to materials and process innovations to shorten commercialization timelines. The initiative aims to move breakthrough technologies from research to full-scale manufacturing faster.