ASML, TSMC, and Imec demonstrated a scalable 300mm manufacturing process for 2D-material transistors. This breakthrough debuted at the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits. The process marks a major step toward industrial adoption of logic devices beyond traditional silicon.
The team produced both nFETs and pFETs on a single 300mm wafer. This represents the first time complementary 2D transistors reached this scale using industry-compatible methods. The transistors feature a contacted poly pitch of 50nm.
This development bridges the gap between laboratory research and mass-producible chip manufacturing. It addresses long-standing challenges in translating 2D materials into commercial semiconductor production.