ASML, TSMC, and Imec successfully demonstrated a scalable 300mm manufacturing process for transistors made from 2D materials. This milestone marks a critical step toward the industrial adoption of post-silicon logic devices.
The collaboration produced both nFETs and pFETs on a single 300mm wafer. These components feature a contacted poly pitch of 50nm. This achievement represents the first time such a scale has been reached using an industry-compatible process.
Researchers presented the results at the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits. Separately, ASML reported recent transactions completed under its ongoing share buyback program.