BE Semiconductor Industries is trading 7% down at €226.90 following reports that key memory customers may delay the transition to its hybrid bonding technology, a critical driver for the company's future growth.
- Samsung and SK Hynix are reportedly considering extending the use of existing bonding methods for current HBM generations, potentially pushing out the timeline for adopting the company's advanced solutions.
- The stock is also being pressured by a broader sell-off across the semiconductor sector as investors express caution over high AI-related capital expenditures and stretched valuations.