BESI.AS is trading 5.5% down at $258.10 following reports of a potential delay in the adoption of hybrid bonding, a critical technology for AI chip interconnects.
- Reuters and ZDNet highlighted concerns that the timeline for this key growth driver could slip, extending a downward trend after a 7.4% slump on Monday.
- The stock is facing additional pressure from sector-wide profit-taking in semiconductor and AI names as investors de-risk following significant year-to-date gains.
- No new company-specific guidance or news has been released beyond the reports regarding the hybrid bonding timeline.