Cadence Design Systems launched the AuraStack AI Super Agent to automate printed circuit board (PCB) and advanced chip packaging design. Engineers use natural language to describe design goals for the AI to plan and execute within Cadence’s software suite.
The platform reduces time-to-market by up to 50%. Cadence claims the tool increases productivity by as much as 15 times.
AuraStack extends the company’s AI-driven design portfolio following previous chip design releases. Nvidia hardware accelerates the platform. Early adopters include Nvidia, TSMC, and Schneider Electric.
The technology manages system-level complexities including electrical, thermal, and mechanical component integration.