Corning Incorporated signed a three-year memorandum of understanding with China’s BOE Technology Group to develop advanced materials.
The collaboration focuses on glass-based packaging substrates, foldable glass, perovskite glass substrates, and optical interconnects.
Semiconductor manufacturers are transitioning to glass-core substrates to improve AI chip computing density and performance.
Corning shares rose 6.2% on May 21 following the announcement.
BOE’s A-shares surged to their 10% daily limit in response to the deal.
BOE clarified the projects are in early exploration and will not materially impact earnings for several years.
The agreement expands Corning’s footprint in the booming AI hardware ecosystem.