SK Hynix presented its next-generation memory strategy at the SEMICON Taiwan 2026 conference. The company introduced a new custom High-Bandwidth Memory (HBM) architecture that integrates computational functions directly into the base die.
This approach aims to eliminate data movement bottlenecks in artificial intelligence processing. The custom HBM technology can improve large language model inference performance by up to 5.15 times.
The strategy prioritizes improvements in capacity, utilization, bandwidth, and efficiency. These advancements are designed to overcome the technical limitations of existing memory hardware.