SK Hynix broke ground on a new advanced packaging facility for AI memory in West Lafayette, Indiana. The company is investing more than $4 billion into the site. This facility represents the first high-bandwidth memory (HBM) packaging base in the United States.
The plant will produce the first next-generation HBM manufactured on American soil. This project aims to strengthen the domestic semiconductor supply chain for the growing artificial intelligence industry.
Mass production is scheduled to begin in the second half of 2029. The project will create approximately 1,000 direct jobs and thousands of indirect positions.
SK Hynix also signed a memorandum of understanding with Purdue University. The partnership focuses on research and development for advanced packaging technology.