Intel reportedly achieved 90% yield rates for its EMIB (Embedded Multi-Die Interconnect Bridge) advanced packaging technology. This development positions Intel as a viable alternative to TSMC, which currently faces capacity constraints for its rival CoWoS packaging.
Google is reportedly adopting EMIB for its next-generation TPU chip. Nvidia also plans to incorporate the technology into a future GPU.
These high-profile partnerships signal growing market confidence in Intel’s foundry business. This momentum could allow the company to capture a larger share of the global semiconductor market.