Intel is in discussions with MediaTek regarding a potential partnership for advanced chip packaging. MediaTek is exploring Intel’s Embedded Multi-die Interconnect Bridge (EMIB) as an alternative to TSMC’s CoWoS technology.
Major industry players, including Google, are encouraging the development of alternative packaging suppliers to diversify the global supply chain. This partnership would provide significant validation for Intel’s foundry strategy and manufacturing capabilities.
The news follows a preliminary chipmaking agreement between Intel and Apple. These developments continue to strengthen investor sentiment regarding Intel’s competitive position in the semiconductor market.