Australian semiconductor startup Syenta raised $26 million to accelerate its new artificial intelligence chip manufacturing technique. The company uses an electrochemical stamping process to create copper connections on chips. This technology reduces the necessary production steps by 40%. It completes the process in minutes rather than hours to ease manufacturing bottlenecks.
Playground Global led the funding round alongside Australia’s government-owned National Reconstruction Fund. Intel CEO Pat Gelsinger will join Syenta’s board of directors as part of the deal.
Syenta plans to open a new office in Arizona near Intel and TSMC manufacturing facilities. The company targets high-volume production by 2028.