Micron Technology announced plans on September 3, 2026, to double its high-bandwidth memory (HBM) production capacity. The company expects to reach this target by the end of the year. New equipment investments will support the production of next-generation HBM4 12-layer products. This expansion aims to close the market share gap with rivals Samsung and SK Hynix.
Increased HBM output provides critical components for Nvidia’s upcoming Vera Rubin AI chips. Analysts forecast a record fiscal fourth quarter for Micron in 2026. Robust DRAM demand and AI sector growth drive these financial projections. Micron has secured long-term HBM supply contracts extending through 2028.