Micron Technology is accelerating its AI memory roadmap. Global Operations VP Manish Bhatia reported that sixth-generation HBM4 capacity is ramping twice as fast as previous versions. Yields for the new chips are improving rapidly.
Micron will outsource base logic dies to TSMC for its next-generation HBM4E chips scheduled for 2027. The company is migrating core DRAM to the advanced 1-gamma process node. This transition utilizes extreme ultraviolet (EUV) lithography.
JPMorgan reiterated a multi-year bullish outlook following the announcement. Analysts stated the TSMC partnership positions Micron as a primary supplier for Nvidia’s upcoming Rubin platform. This move narrows the competitive gap with Samsung and SK Hynix.