Micron Technology is developing a new, tightly coupled DRAM architecture. This technology offers more than 10 times the bandwidth of current High Bandwidth Memory (HBM) solutions. The design significantly improves energy efficiency to address the widening performance gap between processors and memory.
The initiative follows the company's report of record revenue and strong forward guidance fueled by the AI boom. To expand capacity, Micron officially opened a new plant in Tainan, Taiwan. This facility focuses on wafer testing to support the company's global production network.