Qnity Electronics, Inc. introduced Intervia™ 8540HSP copper and Cyclotene™ DF6800M dielectric film. These materials enhance packaging for high-power AI GPUs.
The products support the semiconductor industry's transition to vertical component stacking and glass-core substrate structures. Intervia™ copper enables reliable, fine-pitch redistribution layers. Cyclotene™ film provides precise patterning for glass interposers.
These innovations aim to increase manufacturing yields and reliability for complex AI hardware. The materials address the growing demand for sophisticated interconnects in next-generation package designs.