SK hynix broke ground Thursday on a new advanced packaging and research facility in West Lafayette, Indiana. The South Korean chipmaker is investing more than $4 billion into the site. This project establishes the company's first high-bandwidth memory (HBM) packaging base in the United States.
The facility will house a next-generation HBM packaging line alongside a dedicated R&D center. Operations are scheduled to begin in the second half of 2028. This expansion bolsters the U.S. semiconductor supply chain for critical artificial intelligence components.
The strategic move places production closer to major U.S. customers including Nvidia, Microsoft, and Google. SK hynix shares rose following the announcement and a positive sector outlook. Strong earnings from key partner Nvidia further reinforced the demand for AI memory chips.