Super Micro Computer expanded its liquid cooling portfolio. It introduced ten new Rear Door Heat Exchanger (RDHx) models. These models target high-density AI and High-Performance Computing (HPC) infrastructure.
The solutions help data centers manage intense heat. This heat is generated by modern processors and accelerators. Managing this heat is a growing challenge in the AI era.
The expanded portfolio offers cooling capacities from 10kW up to 120kW per rack door. Data centers can deploy these solutions in both new and existing facilities.
This expansion aligns with Supermicro's Data Center Building Block Solutions® (DCBBS) strategy. The strategy provides end-to-end, validated infrastructure. It aims to accelerate AI factory deployment. It also aims to improve energy efficiency and lower total cost of ownership.