Samsung Electronics introduced its new zHBM technology at the AI Infrastructure Summit on September 17, 2026.
The technology increases conversational AI response speeds from 100 to 1,000 tokens per second. This hardware allows for 3D stacking directly onto AI chips.
Samsung also revealed zNAND-O, a 3D storage solution targeting the edge AI market. The company aims to support trillion-parameter models on local workstations by 2030.