Soitec and ZenSemi have launched a strategic collaboration to produce 300mm BCD-on-SOI technologies. This partnership targets high-volume production for next-generation power electronics.
The technology supports critical applications in AI data centers, electric vehicles, robotics, and industrial sectors. Soitec will supply its advanced 300mm Power-SOI substrates to the Chinese specialty foundry.
The manufacturing platform serves global fabless companies and integrated device manufacturers. Initial silicon validation with a flagship customer confirmed a significant reduction in die size.
Soitec shares rose approximately 8% following the announcement. Investors signaled confidence in the company's ability to meet rising demand across key technology markets.