Taiwan held a groundbreaking ceremony for the new Baipu Industrial Park in Kaohsiung on Monday. TSMC will anchor the hub to develop and validate next-generation packaging technologies alongside equipment and material suppliers.
The project responds to surging demand for complex chip packaging driven by the artificial intelligence boom. President Lai Ching-te noted at the ceremony that advanced packaging has become a key battleground in the global semiconductor industry.
The facility will focus on production efficiency and talent development for sophisticated processes like Chip-on-Wafer-on-Substrate (CoWoS). These technologies are essential for high-performance computing.