Taiwan Semiconductor Manufacturing Co. (TSMC) and Applied Materials formed a partnership to develop AI-era semiconductor technologies. The collaboration expands a relationship spanning over 30 years. Development will take place at Applied Materials' new EPIC Center in Silicon Valley.
The partnership focuses on co-innovation in materials engineering, equipment, and process integration. Engineers will advance solutions for next-generation logic and high-performance computing. The project specifically targets 3D transistor structures to improve device performance and reliability. This initiative aims to accelerate the transition from research to high-volume manufacturing.