TSMC begins its 2026 Technology Symposium in Austin today. The event centers on advancements in artificial intelligence and high-performance computing (HPC).
The company is providing updates on platform solutions for the smartphone, IoT, automotive, and HPC sectors. Attendees are reviewing progress on 3nm, 2nm, and the upcoming A16 logic processes. Presentations will also highlight breakthroughs in 3DFabric advanced silicon stacking and packaging technologies.
TSMC shares rose 6.56% in Taipei on Monday. This surge helped the TAIEX index close above 40,000 points for the first time. Growing demand for AI infrastructure continues to drive these record-breaking market gains.