TSMC projected the global semiconductor market will reach $1 trillion in 2026 during its China Technology Forum in Shanghai. The market is expected to hit $1.5 trillion by 2030. Artificial intelligence serves as the primary driver for this growth. TSMC plans to construct nine new wafer fabrication facilities in 2026. This expansion more than doubles the company's previous average of four new fabs per year.
The company’s technology roadmap highlights progress on 2nm and A16 logic processes. TSMC’s CoWoS advanced packaging solution with a 5.5x reticle size has entered volume production. This packaging technology currently achieves yields exceeding 98%. For mainland China, TSMC committed to supplying 16nm and 28nm capacity to support local innovation.