TSMC reported significant progress in co-packaged optics (COUPE) technology on May 21, 2026. This advancement in high-speed data transmission strengthens TSMC’s position in the advanced packaging sector for AI and high-performance computing.
The development increases pressure on Samsung Electronics, which recently launched pilot production for silicon photonics foundry services. Industry reports indicate Samsung faces a significant gap in matching TSMC’s integrated supply chain ecosystem and technological breakthroughs.