TSMC will adopt ASML’s next-generation High NA extreme ultraviolet (EUV) lithography technology to meet accelerating AI chip demand. The company joins competitors Intel and Samsung in implementing this hardware for advanced nodes. High-volume manufacturing using the new technology is scheduled to begin in 2030.
In collaboration with ASML, TSMC is also leading an industry transition from 6-inch to 12-inch photomasks. This initiative targets a pilot line by 2031. The shift aims to increase factory productivity and lower production costs for complex high-performance computing chips.