Apple has introduced its first 2-nanometer M6 chip, utilizing TSMC’s advanced SoIC-MH and WMCM packaging technologies. This development highlights the deepening technical collaboration between the two companies.
TSMC is significantly expanding its advanced-packaging capacity to support the new hardware. The firm expects WMCM output to reach 60,000 wafers per month by the end of 2026. Capacity is projected to exceed 120,000 wafers per month in 2027.
The expansion follows a broader rally in Asian semiconductor stocks. Shares in TSMC and other regional firms climbed after Nvidia reported strong quarterly earnings.