TSMC shares rose as much as 5.2% in Taiwan trading.
Mizuho Securities increased its forecast for TSMC’s CoWoS packaging capacity. The firm cited a stronger outlook for AI server demand. Revised projections show higher monthly output for 2026 and 2027. Anticipated demand for NVIDIA’s next-generation products drives the revision.
TSMC is also accelerating development of its CoPoS panel-level packaging technology. The company targets mass production for the new technology by 2029.