SK Hynix broke ground on a new advanced packaging facility in West Lafayette, Indiana. The company is investing over $4 billion to build the first U.S. production hub for next-generation High Bandwidth Memory (HBM). These chips serve as critical components for AI accelerators.
The facility is located near Purdue University to foster research and development collaboration. Mass production at the site is scheduled to begin in the second half of 2029.
This investment aims to stabilize the American semiconductor supply chain for top-tier customers. The project supports U.S. economic and national security goals. It is expected to create more than 7,000 direct and indirect local jobs.