Taiwan Semiconductor Manufacturing Co. (TSMC) will produce Xiaomi’s new in-house Xring O3 processor. The manufacturer will utilize its advanced 3-nanometer technology for the production. Xiaomi plans to use the chip in its upcoming flagship foldable smartphone.
This initiative aims to reduce Xiaomi's dependence on external suppliers Qualcomm and MediaTek. The partnership adds Xiaomi to TSMC’s 3nm customer base alongside major firms like Apple. The deal highlights sustained demand for TSMC’s most advanced manufacturing capabilities in the premium mobile sector.