TSMC will headline the SEMICON Taiwan event to present critical AI infrastructure technologies. The company plans to feature its Compact Universal Photonic Engine (COUPE) platform. This technology addresses the growing demand for high-speed data transmission in artificial intelligence and high-performance computing.
The industry is currently transitioning from traditional electrical interconnects to optical communications to improve data center efficiency. TSMC is positioning itself as a leader in silicon photonics and co-packaged optics (CPO). These technologies are essential for meeting the bandwidth requirements of modern AI chips. Large-scale deployment of these solutions is expected to begin this year.