Intel and Lens Technology have launched a strategic partnership to develop advanced semiconductor packaging for the AI era. The collaboration focuses on glass substrates to provide higher performance and power efficiency for data center workloads.
The alliance combines Intel’s semiconductor architecture expertise with Lens Technology’s precision glass processing and high-volume manufacturing capabilities. This initiative aims to accelerate the adoption of next-generation packaging to meet rising AI industry demand.
Both companies are also exploring future development of AI PC components and data center thermal solutions.