TSMC raised its 2030 global semiconductor market outlook to $1.5 trillion. This represents a 50% increase from the previous $1 trillion forecast. Artificial intelligence and high-performance computing are expected to drive 55% of total market demand.
The company will accelerate capacity expansion by building nine new wafer fabs and advanced packaging facilities in 2026. TSMC projects a 70% compound annual growth rate for its 2-nanometer and A16 chip technologies from 2026 to 2028. CoWoS advanced packaging capacity is expected to achieve a compound annual growth rate exceeding 80% between 2022 and 2027.