AMD is investing over $10 billion into Taiwan’s semiconductor and artificial intelligence sectors.
The capital will scale advanced packaging manufacturing to support next-generation AI infrastructure.
AMD is partnering with ASE and SPIL to develop 2.5D Elevated Fan-out Bridge (EFB) technology.
This architecture will increase bandwidth and power efficiency for upcoming Venice EPYC CPUs and Instinct MI450X GPUs.
The investment secures critical packaging capacity and strengthens ties with foundry partner TSMC.
AMD plans to deploy its Helios rack-scale systems in late 2026 to challenge Nvidia’s market dominance.