Samsung Electronics debuted its next-generation HBM5 memory at Computex 2026. The company will use a 2-nanometer process for the base die to boost AI accelerator efficiency. Samsung displayed a physical mock-up of the chips, with mass production scheduled for 2028.
Market leader SK Hynix plans to double its wafer production capacity within five years. SK Group’s chairman confirmed the expansion to address soaring demand for AI memory. Supply constraints are expected to persist for several years.