ASML Holding NV secured commitments from TSMC and Samsung to adopt its High-NA extreme ultraviolet (EUV) lithography systems. Each machine costs approximately $400 million. These chipmakers join Intel, which currently utilizes the technology for high-volume manufacturing. These agreements facilitate the production of next-generation semiconductors for advanced artificial intelligence.
Samsung will deploy the new systems for memory chip production by 2028. TSMC plans to integrate the technology into its advanced nodes starting in 2030.
The companies also launched a joint initiative to transition from 6-inch to 12-inch photomask standards. This shift aims for production readiness by 2033. The larger masks could increase machine output by up to 40%. This transition is expected to lower overall production costs.