Micron confirmed it will use TSMC to manufacture base dies for its next-generation high-bandwidth memory (HBM). This move aligns Micron with competitors SK Hynix and Samsung. TSMC now serves as the primary foundry for all three top memory producers.
The industry shift toward customized AI memory solutions makes TSMC’s specialized logic process expertise indispensable. Memory makers are prioritizing superior performance for advanced AI applications over lower in-house manufacturing costs. This partnership extends TSMC’s dominance from traditional logic chips into the critical memory component sector.